1. 2. 3. material content data sheet sales product name tls820f0el v33 issued 24. august 2015 ma# ma001338860 package pg-ssop-14-5 weight* 82.86 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.743 2.10 2.10 21036 21036 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 416 non noble metal iron 7439-89-6 0.689 0.83 8315 non noble metal copper 7440-50-8 27.978 33.76 34.64 337643 346478 wire non noble metal copper 7440-50-8 0.086 0.10 0.10 1033 1033 encapsulation organic material carbon black 1333-86-4 0.100 0.12 1207 plastics epoxy resin - 4.600 5.55 55517 inorganic material silicondioxide 60676-86-0 45.302 54.69 60.36 546723 603447 leadfinish non noble metal tin 7440-31-5 0.988 1.19 1.19 11927 11927 plating noble metal silver 7440-22-4 0.768 0.93 0.93 9264 9264 glue plastics epoxy resin - 0.141 0.17 1704 noble metal silver 7440-22-4 0.423 0.51 0.68 5111 6815 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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